Heat resistant photoresist composition and process for preparing

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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20415914, 20415919, 20415923, G03C 172, C08G 1800

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active

041804040

ABSTRACT:
An organic polar solvent-soluble aromatic polyamide-imide having therein aromatic nuclei linked at their respective 1- and 3- positions and having therein amide linkages and terminal groups partially substituted with cinnamate groups is found to impart excellent heat resistance and insulating property to a photoresist composition produced therefrom.

REFERENCES:
patent: 3623870 (1971-11-01), Curran et al.
patent: 3918973 (1975-11-01), Mertens
patent: 3929713 (1975-12-01), D'Alelio
patent: 4048144 (1977-09-01), Stephens
patent: 4093461 (1978-06-01), Loprest et al.
patent: 4106943 (1978-08-01), Ikeda et al.

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