Heat resistant photoresist composition and process for preparing

Details Heat resistant photoresist composition and process for preparing Heat resistant photoresist composition and process for preparing

1978-11-16

1980-06-17

Brammer, Jack P.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430288, 20415914, 20415919, 20415923, 20415918, 525453, 525419, G03C 172, G03C 1809

Patent

active

042084776

ABSTRACT:
An organic polar solvent-soluble aromatic polyamide-imide having therein aromatic nuclei linked at their respective 1- and 3-positions and having therein amide linkages and terminal groups unsubstituted or partially substituted with acrylate or methacrylate groups is found to impart excellent heat resistance and insulating property to a photoresist composition produced therefrom.

REFERENCES:
patent: 3623870 (1971-11-01), Curran et al.
patent: 3918973 (1975-11-01), Meriens
patent: 3929713 (1975-12-01), D'Alelio
patent: 4048144 (1977-09-01), Stephens
patent: 4093461 (1978-06-01), Loprest et al.
patent: 4106943 (1978-08-01), Ikeda et al.

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