Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1996-11-18
1997-09-09
Hamilton, Cynthia
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430906, 430920, 4302701, G03F 7004, G03F 734
Patent
active
056655231
ABSTRACT:
A photoresist composition which can form a negative pattern with good heat resistance upon irradiation with actinic rays can be prepared by adding a 4-(2'-nitrophenyl)-1-alkyl (or alkoxyl)-4-dihydropyridine as a photosensitive compound which shows basicity by the irradiation with actinic rays to a resin component comprising a polyimide precursor having a specific structure.
REFERENCES:
patent: 3073784 (1963-01-01), Endrey
patent: 3179614 (1965-04-01), Edwards
patent: 3179630 (1965-04-01), Endrey
patent: 3179631 (1965-04-01), Endrey
patent: 4242437 (1980-12-01), Rohloff
patent: 4331705 (1982-05-01), Samudrala
patent: 4604340 (1986-08-01), Grossa
patent: 5081000 (1992-01-01), Kuehn et al.
Banba et al, Chem. Abst 117:36596x of European Pat. Application 459, 395, printed Dec. 4, 1991, 26 pp. Abstract printed in vol. 117, in 1992 on p. 711.
Omote et al, Chem. Abst. 120:232094h of Jpn Kokai JP 05-281,717 issued Oct. 29, 1993, 7 pp. Abstract printed 1994, vol. 120, p. 1013.
Yamaoka et al, Chem. Abst. 119:282250f of Jpn Kokai JP 05-11,451 issued Jan. 22, 1993, 8 pp. Abstract Printed 1993 in vol. 119 on p. 827.
T. Yamaoka et al, Journal of Imaging Science, vol. 34, No. 2, Mar./Apr. 1990, pp. 50-54.
J.A. Joule et al, Chapter 3, "Pyridines: General Discussion and a Comparison with Benzene", Heterocyclic Chemistry, 2nd ed, Van Nostrand Reinhold Co, London, Eng. 1978, pp. 32-43.
Polymer Preprint Japan, 39(8), 2397 (1990), pp. 2394-2399.
Fujii Hirofumi
Omote Toshihiko
Hamilton Cynthia
Nitto Denko Corporation
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