Heat resistant modified bismaleimide adhesive composition

Details Heat resistant modified bismaleimide adhesive composition Heat resistant modified bismaleimide adhesive composition

1992-06-16

1993-12-07

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525423, 525530, 524879, 528102, 528114, 528117, 528322, C08G 6948, C08G 6926, C08G 5914

Patent

active

052684326

ABSTRACT:
A heat resistant adhesive composition comprising an admixture of a modified bismaleimide (BMI) resin, a modified polyamide-imide and a solvent. The bismaleimide is modified by barbituric acid and/or the derivatives thereof and the polyamide-imide is modified by an epoxy resin. The overall solid content of the heat resistant adhesive composition is in the range of about 15 to 50 percent by weight, wherein solid contents per overall solid content of the modified bismaleimide resin and the modified polyamide-imide are 60 to 90 percent and 10 to 40 percent, respectively.

REFERENCES:
patent: 3886119 (1975-05-01), D'Alelio
patent: 4107153 (1978-08-01), Akiyama et al.
patent: 5041519 (1991-08-01), Pan et al.

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