Heat resistant adhesive composition and bonding method using the

Details Heat resistant adhesive composition and bonding method using the Heat resistant adhesive composition and bonding method using the

1991-11-13

1992-12-15

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

524233, C08G 6912

Patent

active

051718260

ABSTRACT:
A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.

REFERENCES:
patent: 4130469 (1978-12-01), McGinniss
patent: 4543295 (1985-09-01), St. Claim et al.
patent: 4765860 (1988-08-01), Ueno et al.

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