Heat resistant adhesive composition and bonding method using the

Details Heat resistant adhesive composition and bonding method using the Heat resistant adhesive composition and bonding method using the

1990-03-16

1992-02-18

Gallagher, John J.

Stock material or miscellaneous articles

Composite

Of metal

156182, 1562726, 1563075, 156324, 1563311, 524233, 524726, 525422, B32B 1508

Patent

active

050893467

ABSTRACT:
A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.

REFERENCES:
patent: 4130469 (1978-12-01), McGinniss
patent: 4543295 (1985-09-01), St. Clair et al.
patent: 4765860 (1988-08-01), Ueno et al.

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