Heat-resistant adhesive and method of adhesion by using adhesive

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate

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528170, 528173, 528184, 528185, 528322, 528344, 528353, 524606, 524879, 525432, 525436, 525928, C08G 7310, C08G 6926, C08L 7908

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active

053006208

ABSTRACT:
The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent.
The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength. Consequently, the heat-resistant adhesive of the invention is very useful for the adhesion of structural and electronic materials and other industrial materials.

REFERENCES:
patent: 4058505 (1977-11-01), D'Alelio
patent: 4337110 (1982-06-01), Antonoplos et al.
patent: 5116935 (1992-05-01), Lubowitz et al.
patent: 5147966 (1992-09-01), St. Clair et al.
Patent Abstracts of Japan, vol. 11, No. 163, Jun. 19, 1985, JPA 61-291670.

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