Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-03-24
2011-11-01
Vortman, Anatoly (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S709000, C361S710000, C165S080200, C165S080300, C165S104330
Reexamination Certificate
active
08050035
ABSTRACT:
A heat dissipation device includes a heat sink and a cooling fan arranged thereon. The cooling fan includes a motor-stator and an impeller mounted around the motor-stator. The motor-stator is arranged on a middle of the heat sink. The heat sink includes a base and a plurality of fins extending upwardly from the base. The heat sink defines a plurality of notches incising the fins. The notches are angled towards the middle of the heat sink immediately under the motor-stator of the cooling fan.
REFERENCES:
patent: 5386338 (1995-01-01), Jordan et al.
patent: 5464054 (1995-11-01), Hinshaw et al.
patent: 5677829 (1997-10-01), Clemens
patent: 5761041 (1998-06-01), Hassanzadeh et al.
patent: 5943209 (1999-08-01), Liu
patent: 6175499 (2001-01-01), Adams et al.
patent: 6332251 (2001-12-01), Ho et al.
patent: 6894898 (2005-05-01), Liu
patent: 7123483 (2006-10-01), Otsuki et al.
patent: 7142429 (2006-11-01), Hsieh et al.
patent: 7269010 (2007-09-01), Yu et al.
patent: 7518874 (2009-04-01), Deng et al.
patent: 7539017 (2009-05-01), Chang
patent: 7697297 (2010-04-01), Chen et al.
patent: 2002/0162647 (2002-11-01), Wagner
patent: 2003/0019609 (2003-01-01), Hegde
patent: 2003/0048608 (2003-03-01), Crocker et al.
patent: 2005/0141193 (2005-06-01), Otsuki et al.
patent: 2006/0092610 (2006-05-01), Hegde
patent: 2007/0119567 (2007-05-01), Yeh et al.
patent: 2008/0024994 (2008-01-01), Cheng
patent: 2009/0154099 (2009-06-01), Li et al.
patent: 2010/0073878 (2010-03-01), Zha et al.
Ding Jun
Kuo Jer-Haur
Xu Shu-Yuan
Yang Lin
Yu Ye-Fei
Altis Law Group, Inc.
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Vortman Anatoly
LandOfFree
Heat dissipation device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipation device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4253964