Heat dissipation device

Details Heat dissipation device Heat dissipation device

1999-10-15

2001-01-30

Flanigan, Allen (Department: 3743)

Heat exchange

With retainer for removable article

Electrical component

C165S121000, C361S697000

Reexamination Certificate

active

06179046

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat dissipation device with an optimal fin arrangement. More particularly, this invention relates to a heat dissipation device with an optimal fin arrangement for cooling a CPU.
2. Description of the Related Art
Heat dissipation is an important factor in the performance of a central processing unit (CPU). The trend towards increased processor speed has led to an increase in the power dissipation by a CPU. For example, the [power dissipation of a Pentium II is up to 43 W.
FIG. 6
depicts a conventional heat sink, comprising a finned plate
1
and a board member
2
mounted onto the finned plate
1
. The finned plate
1
is made of materials having heat dissipation characteristics, such as aluminum. The finned plate
1
includes a plurality of rows and/or columns of fins
11
extending upwardly from an upper side of the finned plate
1
, wherein gaps
12
are formed among every adjacent fins
11
for the purpose of air convection, and two separable grooves
13
are defined among every adjacent fin block
15
. The board member
2
includes a hole
21
defined in an appropriate portion thereof, and a support member
23
provided in the hole
21
and connected to the periphery defining the hole
21
by a plurality of ribs
22
extending to the support member
23
. A stud
24
is formed on an upper side of the support member
23
and includes a second hole (not labeled) defined therein for rotationally receiving a rotor shaft of the fan
25
.
The finned plate of this heat sink forms a larger heat transfer surface to dissipate heat from the CPU. However, as he heat generated by a CPU increases with advances in processor technology, this dissipation must be optimized.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a heat dissipation device with an optimal fin arrangement for cooling a CPU.
The heat dissipation device with an optimal fin arrangement of this invention comprises a base plate having an upper surface, a first axis, a second axis, and a circular central portion defining a circumference; a plurality of first fins emanating from the upper surface, the first fins being radially arranged around the circumference, wherein a number of the first fins extending substantially in the direction of the first axis terminate before the edge of the base plate, these number of first fins defining directional vectors; a plurality of second fins emanating from the upper surface of the plate, wherein the second fins are separated from the number of first fins by a first gap, and are formed substantially parallel to and on either side of the directional vectors; and a plurality of third fins emanating from the upper surface of the plate, wherein each of the third fins are formed two adjacent second fins and substantially on the directional vectors, and are separated from the first fins by a second gap larger than the first gap.
The first fins are preferably substantially wedge shaped, and the ratio of the breadth of the gap between successive first fins and the thickness of the first fins ranges from 1.2 and 2 at the circumference. The directional vector of each first fin preferably deviates 18° to 30° from a radial line of the circular central portion, the angle of deviation being measured at the intersection of the radial line and the circumference, and the first fins extending substantially in the direction of the second axis terminate at the edge of the base plate. The second fins emanate a further distance from the upper surface than the first fins, while the third fins emanate a lesser distance from the upper surface than the first fins. The base plate and fins are preferably formed by aluminum die casting.
A board member and fan can be installed on the heat dissipation device of this invention to form a heat dissipation unit. The optimal arrangement of fins on the base plate offers superior dissipation of heat generated by a CPU.


REFERENCES:
patent: 4733293 (1988-03-01), Gabuzda
patent: 5740013 (1998-04-01), Roesner et al.
patent: 5867365 (1997-06-01), Chiou
patent: 5927385 (1998-01-01), Yeh
patent: 5947192 (1998-08-01), Kuo

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