Heat dissipating structure for mobile device

Details Heat dissipating structure for mobile device Heat dissipating structure for mobile device

2007-03-13

2007-03-13

Jiang, Chen Wen (Department: 3744)

Refrigeration

Structural installation

With electrical component cooling

C361S700000, C165S104330

Reexamination Certificate

active

10786308

ABSTRACT:
Embodiments of a heat dissipating structure and method for a mobile device can cool components of a mobile terminal. The heat-dissipating structure can include a case, a device mounted in the case that generates heat in connection with its operation, and a cooling unit. The cooling unit can include a housing having a refrigerant therein, a first heat exchanging part for absorbing the heat through a thermal contact with the device and a second heat exchanging part for dissipating the heat.

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