Heat conductive circuit board and method for manufacturing the s

Details Heat conductive circuit board and method for manufacturing the s Heat conductive circuit board and method for manufacturing the s

1987-02-13

1988-11-15

Kittle, John E.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428211, 428233, 428237, 428265, 428285, 4285375, 428901, 162105, 162138, 1621571, 1621815, B32B 300, D21D 300

Patent

active

047848936

ABSTRACT:
A heat conductive circuit board includes an insulating layer provided on a metal substrate, and an electrically conductive metal foil formed on the insulating layer, and the insulating layer is formed by impregnating an alumina paper with organic polymer. The alumina paper is made by subjecting a material containing alumina fiber as the principal components to a paper-making process. The insulating layer has excellent properties of heat transfer not only in the thickness direction but also in the surface direction, and thus, the heat conductive circuit board is excellent in heat dissipation properties.

REFERENCES:
patent: 4578308 (1986-03-01), Hani et al.
patent: 4602238 (1986-07-01), Furtek
patent: 4659906 (1987-04-01), Furtek
patent: 4680220 (1987-07-01), Johnson

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