Heat-activated pressure-sensitive labels

Details Heat-activated pressure-sensitive labels Heat-activated pressure-sensitive labels

2011-06-07

2011-06-07

Nordmeyer, Patricia L (Department: 1788)

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

C428S040500, C428S041700, C428S041800, C428S346000, C428S354000, C156S155000, C156S153000, C156S345420

Reexamination Certificate

active

07955678

ABSTRACT:
A linerless pressure-sensitive label uses a heat-activated, non-tacky dead coat to cover a pressure sensitive substratum. Upon heat activation, the dead coat melts and admixes with an underlying pressure-sensitive adhesive substratum thereby resulting in an exposed pressure-sensitive adhesive. The label can then be applied to packaging or an end product by pressing the adhesive side of the label to the packaging or end product similar to a conventional pressure-sensitive label, however, no silicone-coated release liner is required. The elimination of the silicone-coated release liner results in lower material costs, lower shipping costs and less waste.

REFERENCES:
patent: 4745026 (1988-05-01), Tsukahara et al.
patent: 5292713 (1994-03-01), Stenzel et al.
patent: 5508247 (1996-04-01), Tran et al.
patent: 5569515 (1996-10-01), Rice, II et al.
patent: 5763354 (1998-06-01), Nagamoto
patent: 5840657 (1998-11-01), Mehta et al.
patent: 5866249 (1999-02-01), Yarusso et al.
patent: 5874158 (1999-02-01), Ludwig et al.
patent: 5912204 (1999-06-01), Yamada et al.
patent: 6043190 (2000-03-01), Ichikawa et al.
patent: 6298894 (2001-10-01), Nagamoto et al.
patent: 6383631 (2002-05-01), Mehta
patent: 6388692 (2002-05-01), Iwata et al.
patent: 6492019 (2002-12-01), Shipston et al.
patent: 6500536 (2002-12-01), Yamada et al.
patent: 6501495 (2002-12-01), Ichikawa et al.
patent: 6731319 (2004-05-01), Ichikawa et al.
patent: 6828017 (2004-12-01), Kugo et al.
patent: 2002/0064613 (2002-05-01), Kugo et al.
patent: 2002/0119292 (2002-08-01), Venkatasanthanam et al.
patent: 2003/0112311 (2003-06-01), Naik et al.
patent: 2003/0175507 (2003-09-01), Ikeda et al.
patent: 2004/0001931 (2004-01-01), Izzi et al.
patent: 2004/0234756 (2004-11-01), Mathiaparanam et al.
patent: 2004/0265573 (2004-12-01), Morita et al.
patent: 2007/0252886 (2007-11-01), Sambongi et al.
patent: 2007/0267146 (2007-11-01), Vigunas et al.
patent: 2008/0220969 (2008-09-01), Matsunaga et al.

Affiliated with

Also associated with

Rating

Heat-activated pressure-sensitive labels does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-activated pressure-sensitive labels, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-activated pressure-sensitive labels will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2716126