Heat-absorbing material

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...

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106 56, C04B 3556, C04B 3552

Patent

active

040677435

ABSTRACT:
A heat absorbing material comprising from 12 to 51 wt% of boron carbide, from 7 and 22 wt % of silicon carbide, from 1 and 10 wt % of copper, from 1 and 12 wt % of titanium diboride and from 79 and 5 wt % of carbon.
The heat absorbing material disclosed displays the requisite thermophysical properties, high heat resistance and low density. The thermal conductivity of the material is from 82 and 37 W/m. deg over the range of temperatures from 20 and 1000.degree. C, the specific heat is from 0.94 and 1.74 kJ/kg deg at temperatures varying from 20 and 600.degree. C and the density of the material is from 2.32 and 2.50 g/cm.sup.3.

REFERENCES:
patent: 2154271 (1939-04-01), Higgins
patent: 3340677 (1967-09-01), Alper et al.
patent: 3808012 (1974-04-01), Bailey et al.

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