Head assembly, disk unit, and bonding method and apparatus

Details Head assembly, disk unit, and bonding method and apparatus Head assembly, disk unit, and bonding method and apparatus

2008-03-25

2008-03-25

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

C228S049500, C156S580100

Reexamination Certificate

active

10972440

ABSTRACT:
A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

REFERENCES:
patent: 3628716 (1971-12-01), Fastre
patent: 3750926 (1973-08-01), Sakamoto et al.
patent: 4172907 (1979-10-01), Mones et al.
patent: 4322452 (1982-03-01), Krausse et al.
patent: 4667870 (1987-05-01), Avedissian et al.
patent: 4941034 (1990-07-01), Schrenk
patent: 5274913 (1994-01-01), Grebe et al.
patent: 5460320 (1995-10-01), Belcher et al.
patent: 5707051 (1998-01-01), Tsuji
patent: 5805382 (1998-09-01), Lee et al.
patent: 5877078 (1999-03-01), Yanagida
patent: 5936304 (1999-08-01), Lii et al.
patent: 6084746 (2000-07-01), Shiraishi et al.
patent: 6189760 (2001-02-01), Gotoh et al.
patent: 6269999 (2001-08-01), Okazaki et al.
patent: 6282062 (2001-08-01), Shiraishi
patent: 6437944 (2002-08-01), Ohwe et al.
patent: 6497354 (2002-12-01), Takahashi et al.
patent: 1198000 (1998-11-01), None
patent: 2 256 740 (1992-12-01), None
patent: 57-57556 (1982-04-01), None
patent: 59-208844 (1984-11-01), None
patent: 61-104313 (1986-05-01), None
patent: 61-216436 (1986-09-01), None
patent: 61-046062 (1986-10-01), None
patent: 63-173092 (1988-07-01), None
patent: 2-105405 (1990-04-01), None
patent: 2-105446 (1990-04-01), None
patent: 3-187242 (1991-08-01), None
patent: 4-24950 (1992-01-01), None
patent: 4-47511 (1992-02-01), None
patent: 04-256343 (1992-09-01), None
patent: 4-260358 (1992-09-01), None
patent: 06-275583 (1994-09-01), None
patent: 2589918 (1996-12-01), None
patent: 09-022968 (1997-01-01), None
patent: 09-246307 (1997-09-01), None
patent: 2762639 (1998-03-01), None
patent: 10-241133 (1998-09-01), None
patent: 10-293915 (1998-11-01), None
patent: 11-195215 (1999-07-01), None
patent: 10-1997-0003733 (1997-01-01), None
German Patent Office Communication with translation for corresponding German Patent Application No. 100 20 394.9-55 dated Jan. 24, 2005.
Korean Office Action mailed Sep. 25, 2006 with English translation (7 pages).

Affiliated with

Also associated with

Rating

Head assembly, disk unit, and bonding method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Head assembly, disk unit, and bonding method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Head assembly, disk unit, and bonding method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3944248