Halogen-free dry film photosensitive resin composition

Details Halogen-free dry film photosensitive resin composition Halogen-free dry film photosensitive resin composition

2007-08-28

2007-08-28

Visconti, Geraldina (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S258000, C430S259000, C430S260000, C430S262000, C430S263000, C430S285100, C430S287100, C430S288100

Reexamination Certificate

active

11341878

ABSTRACT:
The present invention provides a halogen-free dry film photosensitive resin composition, which comprises (a) 10˜60 wt % of at least two kinds of acrylic resins having unsaturated carboxylic acid monomers as polymerized units; (b) 5˜20 wt % of a photosensitive resin having at least two (meth)acrylate groups; (c) 0.1˜15 wt % of a photoinitiator; and (d) 0.5˜20 wt % of a thermo-curing agent. The resin composition of the invention is suitable for use as a photoresist in the process of producing printed circuit boards. The resin composition of the invention is particularly suitable for use in the surface of printed circuit boards or semiconductor packages as a protective dry film solder mask.

REFERENCES:
patent: 4725524 (1988-02-01), Elzer et al.

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