Halogen-free and thermal resistant composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Reexamination Certificate

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Details

C524S101000, C524S492000, C524S555000, C523S451000, C523S452000, C523S455000, C428S209000

Reexamination Certificate

active

07834070

ABSTRACT:
The invention provides a halogen-free and thermal resistant composition, including a mixture of bismaleimide and maleimide with molar ratio of 99:1-50:50; a barbituric acid, wherein the molar ratio of the mixture and the barbituric acid is 93:7-80:20; and an epoxy resin, wherein (the mixture with the barbituric acid) and the epoxy resin have a weight ratio of 5:95 to 50:50. The mixture undergoes reaction at 110-130° C. for about 2˜7 hours to form a maleimide modified epoxy resin. The procedure of forming the composition is solvent-free, thereby providing improved integrity for electronic packaging, lower curing temperature, and a simplified process.

REFERENCES:
patent: 5648432 (1997-07-01), Pater et al.
patent: 5932637 (1999-08-01), Ito et al.
patent: 6217987 (2001-04-01), Ono et al.
patent: 6359039 (2002-03-01), Chen et al.
patent: 2006/0116476 (2006-06-01), Cheng
patent: 466265 (1987-04-01), None
English language translation of TW 466265 “High-Performance Adhesive Compositions” Chen Jr-Chiang, et al. published Dec. 2001.
Han et al, Journal of Applied Polymer Science, “Interpenetrating polymer networks of bismaleimide and polyurethane-crosslinked epoxy” vol. 70, Issue 3, Oct. 17, pp. 529-539 (1998).

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