H 2 plasma treatment

Details H 2 plasma treatment H 2 plasma treatment

2007-05-22

2007-05-22

Kebede, Brook (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S650000, C438S654000, C438S675000, C257SE21575, C257SE21576, C257SE21577

Reexamination Certificate

active

10634274

ABSTRACT:
Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive layer to a H2plasma treatment, and depositing a capping adhesion/barrier layer on the core conductive layer after the H2plasma treatment. The multilayer dielectric structure provides an insulating layer for around the core conducting layer and at least one sacrificial layer for processing. The H2plasma treatment removes unwanted oxide from the surface region of the core conducting layer such that the interface between the core conducting layer and the capping adhesion/barrier is substantially free of oxides. In an embodiment, the core conducting layer is copper with a titanium nitride or zirconium capping adhesion/barrier layer.

REFERENCES:
patent: 2842438 (1958-07-01), Saarivirta et al.
patent: 3954570 (1976-05-01), Shirk et al.
patent: 4386116 (1983-05-01), Nair et al.
patent: 4394223 (1983-07-01), Hall
patent: 4423547 (1984-01-01), Farrar et al.
patent: 4565157 (1986-01-01), Brors et al.
patent: 4574095 (1986-03-01), Baum et al.
patent: 4762728 (1988-08-01), Keyser et al.
patent: 4788082 (1988-11-01), Schmitt
patent: 4847111 (1989-07-01), Chow et al.
patent: 4931410 (1990-06-01), Tokunaga et al.
patent: 4948459 (1990-08-01), van Laarhoven et al.
patent: 4962058 (1990-10-01), Cronin et al.
patent: 4996584 (1991-02-01), Young et al.
patent: 5019531 (1991-05-01), Awaya et al.
patent: 5034799 (1991-07-01), Tomita et al.
patent: 5084412 (1992-01-01), Nakasaki
patent: 5100499 (1992-03-01), Douglas
patent: 5130274 (1992-07-01), Harper et al.
patent: 5149615 (1992-09-01), Chakravorty et al.
patent: 5158986 (1992-10-01), Cha et al.
patent: 5171712 (1992-12-01), Wang et al.
patent: 5173442 (1992-12-01), Carey
patent: 5231056 (1993-07-01), Sandhu
patent: 5240878 (1993-08-01), Fitzsimmons et al.
patent: 5243222 (1993-09-01), Harper et al.
patent: 5256205 (1993-10-01), Schmitt, III et al.
patent: 5334356 (1994-08-01), Baldwin et al.
patent: 5354712 (1994-10-01), Ho et al.
patent: 5371042 (1994-12-01), Ong
patent: 5384284 (1995-01-01), Doan et al.
patent: 5413687 (1995-05-01), Barton et al.
patent: 5426330 (1995-06-01), Joshi et al.
patent: 5442237 (1995-08-01), Hughes et al.
patent: 5447887 (1995-09-01), Filipiak et al.
patent: 5461243 (1995-10-01), Ek et al.
patent: 5470789 (1995-11-01), Misawa
patent: 5470801 (1995-11-01), Kapoor et al.
patent: 5476817 (1995-12-01), Numata
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5506449 (1996-04-01), Nakano et al.
patent: 5529956 (1996-06-01), Morishita
patent: 5538922 (1996-07-01), Cooper et al.
patent: 5539060 (1996-07-01), Tsunogae et al.
patent: 5595937 (1997-01-01), Mikagi
patent: 5609721 (1997-03-01), Tsukune et al.
patent: 5625232 (1997-04-01), Numata et al.
patent: 5635253 (1997-06-01), Canaperi et al.
patent: 5635423 (1997-06-01), Huang et al.
patent: 5654245 (1997-08-01), Allen
patent: 5662788 (1997-09-01), Sandhu et al.
patent: 5670420 (1997-09-01), Choi
patent: 5674787 (1997-10-01), Zhao et al.
patent: 5675187 (1997-10-01), Numata et al.
patent: 5679608 (1997-10-01), Cheung et al.
patent: 5681441 (1997-10-01), Svendsen et al.
patent: 5695810 (1997-12-01), Dubin et al.
patent: 5719089 (1998-02-01), Cherng et al.
patent: 5719410 (1998-02-01), Suehiro et al.
patent: 5739579 (1998-04-01), Chiang et al.
patent: 5763953 (1998-06-01), IIjima et al.
patent: 5780358 (1998-07-01), Zhou et al.
patent: 5785570 (1998-07-01), Bruni
patent: 5792522 (1998-08-01), Jin et al.
patent: 5801098 (1998-09-01), Fiordalice et al.
patent: 5814557 (1998-09-01), Venkatraman et al.
patent: 5821168 (1998-10-01), Jain
patent: 5824599 (1998-10-01), Schacham-Diamand et al.
patent: 5858877 (1999-01-01), Dennison et al.
patent: 5891797 (1999-04-01), Farrar
patent: 5891804 (1999-04-01), Havemann et al.
patent: 5893752 (1999-04-01), Zhang et al.
patent: 5895740 (1999-04-01), Chien et al.
patent: 5897370 (1999-04-01), Joshi et al.
patent: 5907772 (1999-05-01), Iwasaki
patent: 5911113 (1999-06-01), Yao et al.
patent: 5913147 (1999-06-01), Dubin et al.
patent: 5925930 (1999-07-01), Farnworth et al.
patent: 5930669 (1999-07-01), Uzoh
patent: 5932928 (1999-08-01), Clampitt
patent: 5933758 (1999-08-01), Jain
patent: 5940733 (1999-08-01), Beinglass et al.
patent: 5948467 (1999-09-01), Nguyen et al.
patent: 5962923 (1999-10-01), Xu et al.
patent: 5968333 (1999-10-01), Nogami et al.
patent: 5969422 (1999-10-01), Ting et al.
patent: 5972179 (1999-10-01), Chittipeddi et al.
patent: 5972804 (1999-10-01), Tobin et al.
patent: 5976710 (1999-11-01), Sachdev et al.
patent: 5981350 (1999-11-01), Geusic et al.
patent: 5985759 (1999-11-01), Kim et al.
patent: 5985762 (1999-11-01), Geffken et al.
patent: 5989623 (1999-11-01), Chen et al.
patent: 5994777 (1999-11-01), Farrar
patent: 6001730 (1999-12-01), Farkas et al.
patent: 6001736 (1999-12-01), Kondo et al.
patent: 6008117 (1999-12-01), Hong et al.
patent: 6015465 (2000-01-01), Kholodenko et al.
patent: 6017820 (2000-01-01), Ting et al.
patent: 6030877 (2000-02-01), Lee et al.
patent: 6037248 (2000-03-01), Ahn
patent: 6037664 (2000-03-01), Zhao et al.
patent: 6054172 (2000-04-01), Robinson et al.
patent: 6054398 (2000-04-01), Pramanick
patent: 6065424 (2000-05-01), Shacham-Diamand et al.
patent: 6069068 (2000-05-01), Rathore et al.
patent: 6071810 (2000-06-01), Wada et al.
patent: 6077792 (2000-06-01), Farrar
patent: 6100193 (2000-08-01), Suehiro et al.
patent: 6107186 (2000-08-01), Erb
patent: 6117781 (2000-09-01), Lukanc et al.
patent: 6117782 (2000-09-01), Lukanc et al.
patent: 6120641 (2000-09-01), Stevens et al.
patent: 6121149 (2000-09-01), Lukanc et al.
patent: 6121150 (2000-09-01), Avanzino et al.
patent: 6126989 (2000-10-01), Robinson et al.
patent: 6136095 (2000-10-01), Xu et al.
patent: 6139699 (2000-10-01), Chiang et al.
patent: 6140228 (2000-10-01), Shan et al.
patent: 6140234 (2000-10-01), Uzoh et al.
patent: 6143604 (2000-11-01), Chiang et al.
patent: 6143646 (2000-11-01), Wetzel
patent: 6143650 (2000-11-01), Pramanick et al.
patent: 6150261 (2000-11-01), Hsu et al.
patent: 6153507 (2000-11-01), Mikagi
patent: 6159769 (2000-12-01), Farnworth et al.
patent: 6162583 (2000-12-01), Yang et al.
patent: 6168704 (2001-01-01), Brown et al.
patent: 6171661 (2001-01-01), Zheng et al.
patent: 6174800 (2001-01-01), Jang
patent: 6177350 (2001-01-01), Sundarrajan et al.
patent: 6181012 (2001-01-01), Edelstein et al.
patent: 6183564 (2001-02-01), Reynolds et al.
patent: 6184121 (2001-02-01), Buchwalter et al.
patent: 6187656 (2001-02-01), Lu et al.
patent: 6190732 (2001-02-01), Omstead et al.
patent: 6194317 (2001-02-01), Kaisaki et al.
patent: 6197688 (2001-03-01), Simpson
patent: 6204096 (2001-03-01), Lai et al.
patent: 6207222 (2001-03-01), Chen et al.
patent: 6207553 (2001-03-01), Buynoski et al.
patent: 6207558 (2001-03-01), Singhvi et al.
patent: 6208016 (2001-03-01), Farrar
patent: 6211049 (2001-04-01), Farrar
patent: 6211071 (2001-04-01), Lukanc et al.
patent: 6211073 (2001-04-01), Ahn et al.
patent: 6221763 (2001-04-01), Gilton et al.
patent: 6224690 (2001-05-01), Andricacos et al.
patent: 6228754 (2001-05-01), Iacoponi et al.
patent: 6232219 (2001-05-01), Blalock et al.
patent: 6232230 (2001-05-01), Iacoponi
patent: 6239017 (2001-05-01), Lou et al.
patent: 6249056 (2001-06-01), Kwon et al.
patent: 6255217 (2001-07-01), Agnello et al.
patent: 6261946 (2001-07-01), Iacoponi et al.
patent: 6262376 (2001-07-01), Hurwitz et al.
patent: 6265311 (2001-07-01), Hautala et al.
patent: 6271592 (2001-08-01), Kim et al.
patent: 6277263 (2001-08-01), Chen
patent: 6280640 (2001-08-01), Hurwitz et al.
patent: 6284656 (2001-09-01), Farrar
patent: 6287954 (2001-09-01), Ashley et al.
patent: 6288442 (2001-09-01), Farrar
patent: 6290833 (2001-09-01), Chen
patent: 6313035 (2001-11-01), Sandhu et al.
patent: 6319834 (2001-11-01), Erb et al.
patent: 6323553 (2001-11-01), Hsu et al.
patent: 6326303 (2001-12-01), Robinson et al.
patent: 6342448 (2002-01-01), Lin et al.
patent: 63506

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