Guide ring removal device

Details Guide ring removal device Guide ring removal device

2003-06-12

2004-04-27

Hail, III, Joseph J. (Department: 3723)

Abrading

Work holder

Work rotating

C451S364000, C451S365000, C451S452000, C451S457000, C451S914000

Reexamination Certificate

active

06726554

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a guide ring removal device, and more especially to device enabling safer and more convenient guide ring removal.
2. Description of the Related Art
In chemical mechanical process (CMP), a carrier holds and moves a wafer. As shown in
FIG. 1
, the carrier
100
comprises a cover ring
108
, a barrier
106
, a holding ring
104
, a guide ring
102
, a backing film
101
, and shims
103
,
105
,
107
.
The cover ring
108
, the barrier
106
and the holding ring
104
constitute a pressure chamber. As the carrier
100
holds the wafer, the pressure in the chamber decreases to affix the wafer to the surface of the backing film
101
. As a pad polishes the wafer, the pressure chamber imposes back pressure on the wafer to contact the wafer with the pad and improve the wafer polishing effect.
As the pressure chamber imposes the back pressure on the wafer, the guide ring
102
prevents the wafer from slipping. As shown in
FIG. 2
, as the carrier
100
holding the wafer
150
, the guide ring
102
fixes the wafer
150
and keeps it from slipping. In addition, as shown in
FIG. 3
a
, during polishing, the pad
160
, under the weight of the carrier, bulges upward around the periphery of the wafer. Without the guide ring
102
, this bulging promotes over-polishing on an edge portion
155
of the wafer
150
. As shown in
FIG. 3
b
, the guide ring
102
is provided, spreading the polishing surface, to prevent the edge portion
155
of the wafer
150
from excess contact with the pad, thereby avoiding over-polishing of the wafer.
In carrier maintenance, the guide ring
102
must be separated from the carrier
100
. However, the slurry and the chemicals used in polishing and particles generated thereby can adhere the guide ring
102
to the carrier
100
, making separation of the guide ring
102
difficult. Conventionally, the guide ring
102
is separated by prying, requiring undue time and effort, possible damage to the guide ring
102
and the carrier
100
, and presenting possible safety risks.
SUMMARY OF THE INVENTION
For these reasons, there is a clear need for a device enabling safer and more convenient guide ring removal.
The present invention includes a column press, a first disc, a second disc, and a plurality of fasteners. The first disc is disposed on the column press. The second disc is disposed on a point of the column press to exert force on a carrier. The plurality of fasteners is disposed on the first disc, grasping the guide ring. As the second disc exerts the primary force on the carrier, the fasteners generate reciprocal force on the guide ring, thus separating the guide ring. Engagement of the column press alters the distance between the first disc and the second disc, and the primary force is exerted on the carrier.
With the present invention, guide ring separation is rendered easier and safer, and damage to the guide ring is avoided.


REFERENCES:
patent: 6206768 (2001-03-01), Quek

Affiliated with

Also associated with

Rating

Guide ring removal device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Guide ring removal device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Guide ring removal device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3253531