Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1983-09-12
1984-04-24
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156603, 156612, 156647, 1566591, 156662, 156DIG64, 156DIG65, 156DIG70, 156DIG111, 427 86, B05D 512, B44C 122, C03C 1500, H01L 21306
Patent
active
044446209
ABSTRACT:
Improvements in the lateral recrystallization of semiconductor material on buried insulator are disclosed. In particular, in the zone-melting process applied to seeded Si, it is found that scanning the molten zone in a [110] direction can result in substantially subboundary-free recrystallized material. Furthermore, appropriate patterning of the capping layer, to provide means for accommodating the volume change attending solidification of the semiconductor material, can result in significant decrease of defect density in laterally recrystallized semiconductor material on insulator. Especially advantageous results are produced when combining the improvements.
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patent: 4371421 (1983-02-01), Fan
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Kovacs Terrence
Pfeiffer Loren N.
Bell Telephone Laboratories Incorporated
Pacher Eugen E.
Powell William A.
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