Grounding for enclosures

Details Grounding for enclosures Grounding for enclosures

1996-07-25

1998-09-29

Kincaid, Kristine L.

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

174 521, 361816, H05K 900

Patent

active

058147624

ABSTRACT:
An apparatus is provided to reduce the amount of EMI generated by a circuit. The grounding of an enclosure is improved by providing a number of shaped protuberances, the protuberances having an end that penetrates a conductive region of a circuit board, such that when the circuit board is mounted to the support member, the protuberances make a penetrating electrical contact and provides for additional ground paths, thereby reducing the EMI generated by the assembly.

REFERENCES:
patent: 3366918 (1968-01-01), Johnson et al.
patent: 4948923 (1990-08-01), Suzuui
patent: 5043848 (1991-08-01), Rogers et al.
patent: 5175395 (1992-12-01), Moore
patent: 5239127 (1993-08-01), Swiule et al.
patent: 5365410 (1994-11-01), Lonua
patent: 5373101 (1994-12-01), Barabolau
patent: 5459640 (1995-10-01), Moutrie et al.

Affiliated with

Also associated with

Rating

Grounding for enclosures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Grounding for enclosures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Grounding for enclosures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-687434