Grounding for enclosures

Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition

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Details

174 521, 361816, H05K 900

Patent

active

058147624

ABSTRACT:
An apparatus is provided to reduce the amount of EMI generated by a circuit. The grounding of an enclosure is improved by providing a number of shaped protuberances, the protuberances having an end that penetrates a conductive region of a circuit board, such that when the circuit board is mounted to the support member, the protuberances make a penetrating electrical contact and provides for additional ground paths, thereby reducing the EMI generated by the assembly.

REFERENCES:
patent: 3366918 (1968-01-01), Johnson et al.
patent: 4948923 (1990-08-01), Suzuui
patent: 5043848 (1991-08-01), Rogers et al.
patent: 5175395 (1992-12-01), Moore
patent: 5239127 (1993-08-01), Swiule et al.
patent: 5365410 (1994-11-01), Lonua
patent: 5373101 (1994-12-01), Barabolau
patent: 5459640 (1995-10-01), Moutrie et al.

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