Abrading – Machine – Rotary tool
Reexamination Certificate
2006-10-10
2006-10-10
Rose, Robert A. (Department: 3723)
Abrading
Machine
Rotary tool
C451S342000, C451S509000
Reexamination Certificate
active
07118465
ABSTRACT:
A semiconductor manufacturing apparatus includes a wafer support having a grinding base on which a wafer is disposed, and a grinding assembly disposed above the grinding base. The grinding assembly includes a grinding plate having grinding projections at the bottom thereof and at least two fixing pins protruding at a the top thereof, and a grinding mount to which the grinding plate to which the grinding plate can be initially coupled and then secured to quickly. The grinding mount has first fixing grooves in a bottom surface thereof and in which the respective fixing pins are inserted and held. A vacuum system and/or mechanical fasteners are used to then secure the grinding plate to the grinding mount.
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Rose Robert A.
Samsung Electronics Co,. Ltd.
Volentine Francos & Whitt PLLC
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