Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-03-29
1995-07-25
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156250, 156257, 156289, 428343, 428352, B32B 3100
Patent
active
054358760
ABSTRACT:
Active sites (18) on a semiconductor wafer (14) are protected from particulate and fluid contaminants (40,42)while the wafer (14) is sawed into chips (16) by a tape (62) carrying a pattern of adhesive (64) which is congruent and registerable with saw paths (15) between the active sites (18). Adhering the tape (62) to the wafer (14) encapsulates each active site (18) beneath a non-adherent protective envelope which if formed by adhesive-free portions (68) of the tape (62) as sawing occurs along the saw paths (15) and the congruent adhesive pattern (64). After sawing, the adhesive (64) is treated, as by directing UV through the tape (62), to release the tape (62) from the chips (16).
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Alfaro Rafael C.
Blair David
Donaldson Richard L.
Kesterson James C.
Klinger Robert C.
Rivard Paul M.
Simmons David A.
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