Graphite lid seal fixture

Details Graphite lid seal fixture Graphite lid seal fixture

1993-10-28

1994-12-13

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228 491, 228212, B32B 300

Patent

active

053722965

ABSTRACT:
In manufacturing packaged modules for computer systems, many modules require sealing a lid to a lower substrate by using solder around the outer edges of the lower substrate. When the solder is heated, it often flows inward towards the chips on the substrates (solder intrusions) and may cause shorts. This invention solves the problem of solder intrusions by using a graphite lid seal fixture during lid seal. The fixture is comprised of lower and upper parts. The substrate, which has a sealband area, rests on and is held in place by the lower part of the fixture. The upper part of the fixture rests on the lower part. The lid, which has solder on its lower surface which is slightly smaller but otherwise generally matches the sealband area of the substrate, fits in a hole in the upper part and rests on the substrate. Thus, graphite substantially surrounds the edges where the lid and substrate meet and the fixture evenly distributes the heat around the sealband during reflow so that the solder can flow out towards the edge of the sealband. By this means, areas where solder flows back into the interior of the module are reduced and hermeticity yields are improved.

REFERENCES:
patent: 3436201 (1969-04-01), Tsuji et al.
patent: 3768991 (1973-10-01), Rogers
patent: 4804130 (1989-02-01), Kwan et al.
Hitachi, Ltd., Hermetic Sealing Process With Atmospheric Pressure Vibration for LSI Packages, 1991, IEEE.

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