4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Sheila J. Konecke

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Ball grid array (BGA) to column grid array (CGA) conversion...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Graphite lid seal fixture

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Profile ID: LFUS-PAI-P-1298831

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