Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1998-04-24
2000-07-04
Powell, William
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
438719, 438738, 438753, H01L 2100
Patent
active
060838469
ABSTRACT:
A transistor and transistor fabrication method are presented where a sequence of layers are formed and either entirely or partially removed upon sidewall surfaces of a gate conductor. The formation and removal of layers produces a lateral surface to which various implants can be aligned. Those implants, placed in succession produce a highly graded junction having a relatively smooth doping profile. Preferably, the multi-layer spacer structure comprises a polysilicon spacer interposed between a grown oxide and an etch stop. The oxide is grown upon the polysilicon to align a source/drain implant. Either before the source/drain implant or after the source/drain implant, the oxide and polysilicon partially consumed by the oxide is removed to provide a lateral surface to which an MDD implant aligns. A combination of etch stop, polysilicon spacer and grown possibly sacrificial oxide allows a greater ease by which multiple implants can be forwarded into junctions of either an NMOS or PMOS transistor.
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Wolf et al., Silicon Processing for the VLSI Era, Vol. 1: Process Technology, Lattice Press 1986, p. 183.
Fulford Jr. H. Jim
Gardner Mark I.
Hause Fred N.
Advanced Micro Devices , Inc.
Daffer Kevin L.
Powell William
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