Glow discharge etching process for chromium

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156646, 156652, 156656, 1566591, 204192E, 252 791, C23F 102

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active

042292476

ABSTRACT:
Chromium is etched in a glow discharge without attack on Al/Cu, Si, SiO.sub.2, and Si.sub.3 N.sub.4 layers by etching in a low pressure ambient atmosphere containing a polychlorinated organic compound such as CCl.sub.4, water, and a material selected from the group consisting of the noble gases and oxygen.

REFERENCES:
patent: 3615956 (1971-10-01), Irving et al.
patent: 3951709 (1976-04-01), Jacob
patent: 3975252 (1976-08-01), Fraser et al.
patent: 3994793 (1976-11-01), Harvilchuck
Kodak Microelectronics Seminar 1976, A Study of the Optical Emission from a R7 Plasma During Semiconductor Etching, by W. R. Harshbarger et al, pp. 1-14.
IBM Technical Disclosure Bulletin, vol. 19, No. 3, Aug. 1976, Etching Fine Patterns in Chromium and Refractory Metals by H. C. Kluge et al, p. 900.
IBM Technical Disclosure Bulletin, vol. 20, No. 2, Jul. 1977, Increasing the Selectivity of the Plasma Etch Rate of SiO.sub.2 Relative to Si, p. 757.

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