Global planarization method

Semiconductor device manufacturing: process – Chemical etching – Having liquid and vapor etching steps

Reexamination Certificate

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Details

C438S692000, C438S694000, C438S725000, C216S088000

Reexamination Certificate

active

06884729

ABSTRACT:
Methods for manufacturing substrates with difficult to polish features using reverse mask etching and chemical mechanical planarization techniques.

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