Global chip interconnect

Details Global chip interconnect Global chip interconnect

2005-01-11

2005-01-11

Chang, Daniel D. (Department: 2819)

Electronic digital logic circuitry

Multifunctional or programmable

Significant integrated structure, layout, or layout...

C326S015000, C326S038000

Reexamination Certificate

active

06842042

ABSTRACT:
A global interconnect distribution system is disclosed. The global interconnect distribution system includes a global interconnect cell capable of producing at least two substantially identical output signals, and a global interconnect coupled to the cell for carrying one of the output signals. At least one wire is also coupled to the cell that is routed adjacent to the global interconnect for carrying the other output signal to provide active shielding for the global interconnect, thereby increasing signal integrity and signal transmission of the global interconnect.

REFERENCES:
patent: 5436573 (1995-07-01), Ogawa et al.
patent: 5983006 (1999-11-01), Carlson
patent: 6281704 (2001-08-01), Ngai
patent: 6285208 (2001-09-01), Ohkubo
patent: 6456117 (2002-09-01), Tanaka
Direct Rambus™ ASIC Package Selection Guide Version 0.1, Rambus, Inc., Nov. 1999 pp. 1-18.

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