4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Piyush Chaudhari

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Glass/Metal package and method for producing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Piezoelectric resonator using sacrificial layer and method...

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-648845

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