Glass for semiconductor encapsulation and outer tube for...

Details Glass for semiconductor encapsulation and outer tube for... Glass for semiconductor encapsulation and outer tube for...

2005-09-29

2008-12-30

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257SE23118, C501S055000

Reexamination Certificate

active

07470999

ABSTRACT:
An object of the invention is to provide glass for semiconductor encapsulation and an outer tube for semiconductor encapsulation which are friendly to environment and allow semiconductor electronic parts to have a heat resistance of 700° C. or higher as normal maximum temperature, and semiconductor electronic parts. The glass for semiconductor encapsulation according to the invention contains essentially no lead and the temperature at which viscosity reaches 1010dPa·s is 700° C. or higher. According to such a constitution, since the glass contains essentially no lead, no harmful ingredients are discharged in the production of the outer tube for semiconductor encapsulation and in the production of the semiconductor electronic parts and thus the glass is friendly to environment. Moreover, since the temperature at which viscosity reaches 1010dPa·s is 700° C. or higher, semiconductor electronic parts such as a bead thermistor using the same has a heat resistance of 700° C. or higher as normal maximum temperature.

REFERENCES:
patent: 6063718 (2000-05-01), El Khiati et al.
patent: 2003/0124774 (2003-07-01), Kosokabe
patent: 2-97435 (1990-04-01), None
patent: 8-67534 (1996-03-01), None
patent: 8-78208 (1996-03-01), None
patent: 10-291833 (1998-11-01), None
patent: 2002-37641 (2002-02-01), None
International Search Report for PCT/JP2005/017972 mailed Nov. 1, 2005.

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