Glass conditioning for ceramic package plating

Details Glass conditioning for ceramic package plating Glass conditioning for ceramic package plating

1989-02-09

1990-10-16

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 321, C25D 502, C25D 534

Patent

active

049632337

ABSTRACT:
When ceramic packages are subjected to lead plating the solutions can reduce the glass oxides and produce metallization of the sealing glass. At best, this metallization is unsightly and at worst results in lead shorting. Such metallization can be greatly reduced or avoided by a pretreatment that passivates the glass. The pretreatment comprises an immersion in an aqueous solution of fluoboric acid or ammonium bifluoride. Improved solutions that additionally contain a wetting agent and other additives are disclosed.

REFERENCES:
patent: 4610798 (1986-09-01), Burkus
patent: 4773940 (1988-09-01), Layher

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