Gettering regions and methods of forming gettering regions withi

Active solid-state devices (e.g. – transistors – solid-state diode – Including region containing crystal damage

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257913, H01L 2930, H01L 2358

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active

059295074

ABSTRACT:
In one aspect, the invention pertains to a method of forming a gettering region within an Si semiconductor wafer, the method including: a) providing a semiconductor material wafer; b) providing a background region within the semiconductor material wafer, the background region being doped with a first-type conductivity enhancing dopant, the first-type conductivity enhancing dopant being either n-type or p-type; c) implanting a second-type conductivity enhancing dopant into the background region to form a second-type implant region entirely contained within the background region, the second-type conductivity enhancing dopant being of an opposite type than the first-type conductivity enhancing dopant of the background region; and d) implanting a neutral-conductivity-type conductivity enhancing dopant into the second-type implant region to form a metals gettering damage region entirely contained within the second-type implant region. The invention also pertains to gettering region structures.

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Handout, 2nd annual "Smart and Economic Device and Process Designs for ULSI MeV Technology" Seminar, sponsored by Genus, Inc., Jul. 20, 1994, 10 pages .

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