Gettering of particles from an electro-negative plasma with insu

Details Gettering of particles from an electro-negative plasma with insu Gettering of particles from an electro-negative plasma with insu

1995-04-27

1996-12-24

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

118723E, 118723ER, 156345, H01L 21306

Patent

active

055870457

ABSTRACT:
Apparatus controls a wafer potential in a plasma system when the plasma is off to keep the wafer slightly negative at all times in order to reduce and eliminate the collection of charged particles on the wafer. The apparatus allows the wafer bias to be reduced to a small negative voltage and then holds that voltage. This greatly reduces the net positive flux to the wafer. A diode and a programmed power supply hold a minimum negative voltage on the back of the wafer electrode when the plasma density is decaying to zero.

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patent: 5433813 (1995-07-01), Kuwabara
patent: 5460684 (1995-10-01), Saeki et al.

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