Gate electrode formed on a region ranging from a gate insulating

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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Details

257364, 257412, 257655, 257755, 257757, 257764, H01L 2906, H01L 2978

Patent

active

054163528

ABSTRACT:
The invention relates to a semiconductor device having an electrode formed on an region ranging from its thin insulating film in an element forming region to its thick insulating film in an isolation region, and it is an object of the invention to provide a semiconductor device capable of improving dielectric strength of a thin insulating film under a electrode in the boundary region between a thin insulating film and a thick insulating film as well as improving the film quality of the thin insulating film. A semiconductor device according to the present invention comprises a thick insulating film partly formed on a semiconductor substrate, a thin insulating film formed on the semiconductor substrate adjacent to the thick insulating film, a first electrode layer composed of a semiconductor layer which is formed in a region ranging from the thin insulating film to the thick insulating film and has a higher resistance in a boundary region between the thin insulating film and the thick insulating film and a lower resistance except for the boundary region, and a second electrode layer formed on the first electrode layer.

REFERENCES:
patent: 4894689 (1990-01-01), Cooper, Jr. et al.
"Elimination of Stacking Faults in Silicon Wafers by HCl Added Dry O.sub.2 Oxidation", Shiraki, Japanese Journal of Applied Physics, vol. 14, No. 6, Jun., 1975, pp. 747-752.

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