Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
Reexamination Certificate
2005-06-07
2005-06-07
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
Insulated gate formation
C257S072000, C257S410000, C257S413000, C438S305000, C438S682000, C438S775000
Reexamination Certificate
active
06902993
ABSTRACT:
In one embodiment, a gate of a transistor is formed by performing a first thermal treatment on a silicon layer, forming a metal stack over the silicon layer, and performing a second thermal treatment on the metal stack. The first thermal treatment may be a rapid thermal annealing step, while the second thermal treatment may be a rapid thermal nitridation step. The resulting gate exhibits relatively low interface contact resistance between the silicon layer and the metal stack, and may thus be advantageously employed in high-speed devices.
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Blosse Alain
Gopalan Prabhuram
Ramkumar Krishnaswamy
Cypress Semiconductor Corporation
Nelms David
Nguyen Dao H.
Okamoto & Benedicto LLP
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