Gate edge diode leakage reduction

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S369000

Reexamination Certificate

active

06847089

ABSTRACT:
An embodiment of the invention is an integrated circuit2having halo atoms12concentrated at a gate side of a channel region and impurity atoms14within the channel region. Another embodiment of the invention is a method of manufacturing an integrated circuit that includes the implantation of impurity atoms14into a semiconductor substrate11.

REFERENCES:
patent: 6436783 (2002-08-01), Ono et al.
H.H. Vuong, et al., “Influence of Fluorine Implant on Boron Diffusion: Determination of Process Modeling Parameters” J. Appl. Phys. 77 (7), Apr. 1, 1995, pp. 3056-3060.
Song Zhao, et al., “GIDL Simulation and Optimization for 0.13μm/1.5V Low Power CMOS Transistor Design” 2002 International Conference on Simulation of Semiconductor Processes and Devices, pp. 43-48.

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