Gas ring apparatus for semiconductor etching

Details Gas ring apparatus for semiconductor etching Gas ring apparatus for semiconductor etching

1999-04-02

2000-09-05

Beck, Shrive

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118728, H05H 100, C23C 1600

Patent

active

061137367

ABSTRACT:
A gas ring with curved surface on the edge of the gas-guiding trench of a gas ring apparatus is disclosed. The apparatus includes a ring-shaped body located on bottom of an etch chamber, wherein the ring-shaped body has a ring-shaped gas-guiding trench formed on the bottom surface and inside of the ring-shaped body, and wherein the intersection of sidewall of the ring-shaped gas-guiding trench and the bottom surface of the ring-shaped body has a curved bending surface. At least one gas hole extends from the top surface of the ring-shaped body to the ring-shaped gas-guiding trench. The apparatus also includes a first ring-shaped seal and a second ring-shaped seal situated on the bottom surface of the ring-shaped body. A blocking layer is formed to cover the surface of the ring-shaped body.

REFERENCES:
patent: 5837058 (1998-11-01), Chen et al.

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