Gas injector for use in semiconductor etching process

Details Gas injector for use in semiconductor etching process Gas injector for use in semiconductor etching process

1996-09-24

1998-07-21

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118715, 118723E, 118723R, 20429807, 20429833, H05H 100

Patent

active

057830231

ABSTRACT:
A gas injector for use in a semiconductor etching process including a plurality of injecting holes on the central portion thereof, for injecting process gases, a plurality of bolt holes formed on edges of the gas injector, facewise against a gas supply for securing the gas injector, a plurality of bolt head-accommodating slots formed on a first gas injecting face, for receiving the heads of the bolts, and a second gas injecting disposed plurality of bolt head accommodating slots on a face opposite to the first gas injecting face, whereby the gas injector can be successively installed each side down and thus, reused after the side first disposed towards the semiconductor workpieces has become too etched to provide the desired injection pattern.

REFERENCES:
patent: 4612077 (1986-09-01), Tracy et al.
patent: 5422139 (1995-06-01), Fischer

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