Gas flow control in a substrate processing system

Details Gas flow control in a substrate processing system Gas flow control in a substrate processing system

1998-07-13

2000-01-25

Bennett, Henry

Drying and gas or vapor contact with solids

Apparatus

Vacuum

34210, F26B 1330

Patent

active

060166118

ABSTRACT:
A substrate processing system can include an evacuable chamber adjacent a process chamber and back-to-back process chambers, or other combinations of evacuable chambers and process chambers. The processing system includes various isolation valves disposed between adjacent chambers, as well as gas flow valves and vacuum valves. A controller controls the respective positions of the various gas flow valves and vacuum valves depending, in part, on whether the various isolation valves are in their open or sealed positions. By controlling the positions of the valves, the flow of gas to and from the different chambers can be controlled, for example, to help maximize throughput, increase efficiency, and reduce the likelihood of cross-contamination between chambers.

REFERENCES:
patent: 5516367 (1996-05-01), Lei et al.

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