Coating apparatus – Gas or vapor deposition
Reexamination Certificate
2006-03-28
2011-10-11
Kackar, Ram (Department: 1716)
Coating apparatus
Gas or vapor deposition
C156S345330, C156S345340
Reexamination Certificate
active
08034176
ABSTRACT:
A post-etch treatment system is described for removing photoresist and etch residue formed during an etching process. For example, the etch residue can include halogen containing material. The post-etch treatment system comprises a vacuum chamber, a remote radical generation system coupled to the vacuum chamber, a radical gas distribution system coupled to the radical generation system and configured to distribute reactive radicals above a substrate, and a high temperature pedestal coupled to the vacuum chamber and configured to support the substrate. The gas distribution system is configured to efficiently transport radicals to the substrate and distribute the radicals above the substrate.
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Hamelin Thomas
Kim Sam Yong
Tomozawa H. Steven
Tsukamoto Yuji
Chandra Satish
Kackar Ram
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Tokyo Electron Limited
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