Gas distribution system for a post-etch treatment system

Coating apparatus – Gas or vapor deposition

Reexamination Certificate

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Details

C156S345330, C156S345340

Reexamination Certificate

active

08034176

ABSTRACT:
A post-etch treatment system is described for removing photoresist and etch residue formed during an etching process. For example, the etch residue can include halogen containing material. The post-etch treatment system comprises a vacuum chamber, a remote radical generation system coupled to the vacuum chamber, a radical gas distribution system coupled to the radical generation system and configured to distribute reactive radicals above a substrate, and a high temperature pedestal coupled to the vacuum chamber and configured to support the substrate. The gas distribution system is configured to efficiently transport radicals to the substrate and distribute the radicals above the substrate.

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