Gap control system for localized vacuum processing

Radiant energy – Inspection of solids or liquids by charged particles – Analyte supports

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2504421, 2504422, 219121EN, 219121EQ, 219121EX, 219121EY, H01J 3718, H01J 3720, H01J 3302

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active

045284512

ABSTRACT:
Apparatus for controlling the gap between localized vacuum processing envelope apparatus and a workpiece as the workpiece, typically a semiconductor wafer, is moved laterally with respect to the envelope apparatus. The envelope apparatus includes an envelope which defines an internal vacuum processing zone and a generally planar tip spaced from the workpiece during processing by the gap. The gap control apparatus includes a gap sensor for measuring the gap, a control circuit for comparing the measured gap with a required gap and generating an error signal, and an actuating means for varying the gap in response to the error signal. The gap can be sensed by sensing the pressure level in the vacuum processing apparatus. The actuating means can include a plurality of piezoelectric actuators which can vary both the gap and the angle of the workpiece with respect to the tip of the vacuum processing apparatus. The disclosed apparatus is particularly useful in connection with particle beam systems such as electron beam lithography systems. In another embodiment, the gap is controlled by an air bearing between the envelope apparatus and the workpiece.

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