Gang bonding interconnect tape process and structure for semicon

Details Gang bonding interconnect tape process and structure for semicon Gang bonding interconnect tape process and structure for semicon

1980-04-14

1982-05-25

Husar, Francis S.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having marginal feature for indexing or weakened portion for...

29827, 29576S, 29588, 174 52FP, 357 70, B22F 0000, H01R 4300

Patent

active

043317405

ABSTRACT:
A continuous tape is employed in the automatic assembly of semiconductor devices. The tape contains a sequential series of patterns, each one comprising a plurality of metal fingers. Each pattern includes fingers having an inward extension that terminates in a configuration that mates with the contact pattern of the semiconductor device. Desirably these fingers are thermocompression gang bonded to the semiconductor contact pads. This attaches the semiconductor device to the tape for further processing. In one assembly method the fingers have an outward extending portion that is designed for bonding to a secondary structure such as a lead frame destined to become part of the final housing. The fingers in the pattern are joined together by means of a ring located at or near the point at which they are bonded to the lead frame. After the lead frame bonds are achieved, preferably by thermocompression gang bonding, the ring is severed at locations between the fingers. If desired, the ring structure can be weakened at those points where it is to be severed.

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patent: 4188438 (1980-02-01), Burns

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