GaN heterojunction bipolar transistor with a p-type strained...

Active solid-state devices (e.g. – transistors – solid-state diode – Bipolar transistor structure

Reexamination Certificate

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C257SE27046, C257SE29171

Reexamination Certificate

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07622788

ABSTRACT:
A gallium nitride heterojunction bipolar transistor with a p-type strained InGaN base layer is provided. The gallium nitride heterojunction bipolar transistor includes a substrate, a highly doped collector contact layer located over the substrate, a low doped collector layer located over the collector contact layer, a p-type base layer located over the collector layer, a highly doped strained InGaN base layer located over the p-type base layer, a emitter layer located over the p-type strained InGaN base layer, a highly doped emitter contact layer located over the emitter layer, and an emitter metal electrode, a base metal electrode, and a collector metal electrode respectively located on the emitter contact layer, the p-type strained InGaN base layer, and the collector contact layer.

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patent: 2002/0149033 (2002-10-01), Wojtowicz
patent: 2002/0195619 (2002-12-01), Makimoto et al.
patent: 2005/0116319 (2005-06-01), Twynam
patent: 2005/0121696 (2005-06-01), Nakazawa et al.
patent: 2005/0156195 (2005-07-01), Chen et al.
“Low-resistance nonalloyed ohmic contact to p-type Gan using strained InGaN contact layer” jointly authored by Kumakura et al., Applied Physics Letters, Oct. 15, 2001, pp. 2588-2590, vol. 79, No. 16., American Institute of Physics.
“Ohmic contacts to p-type GaN mediated by polarization fields in thin InxGa1-xN capping layers” jointly authored by Gessmann et al., Applied Physics Letters, Feb. 11, 2002, pp. 986-988, vol. 80, No. 6., American Institute of Physics.
“High hole concentrations in Mg-doped InGaN grown by MOVPE” jointly authored by Kumakura et al., Journal of Crystal Growth, pp. 267-270, vol. 221, Elsevier Science 2000.

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