Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2007-09-25
2007-09-25
Smith, Zandra V. (Department: 2822)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S455000
Reexamination Certificate
active
11194237
ABSTRACT:
A gallium nitride device substrate comprises a layer of gallium nitride containing an additional lattice parameter altering element located over a substitute substrate.
REFERENCES:
patent: 6133058 (2000-10-01), Kidoguchi et al.
patent: 6744064 (2004-06-01), Lee et al.
patent: 2004/0209402 (2004-10-01), Chai et al.
Critical layer thickness determination of GaN/InGaN/GaN double heterostructures; M.J. Reed et al., Applied Physics Letters vol. 77, No. 25, Dec. 18, 2000, pp. 4121-4123.
Corzine Scott W.
Lester Steven D.
Robbins Virginia M.
Avago Technologies ECBU (IP) Singapore Pte. Ltd.
Perkins Pamela E
Smith Zandra V.
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