GaAs-based MOSFET, and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257289, 257631, 438606, 438779, 438767, 438236, H01L21/316;23/58

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059030372

ABSTRACT:
It has been found that a Ga-oxide-containing layer is substantially not etched in HF solution if the layer is a Ga-Gd-oxide with Gd:Ga atomic ratio of more than about 1:7.5, preferably more than 1:4 or even 1:2. This facilitates removal of a protective dielectric (typically SiO.sub.2) layer after an ohmic contact anneal, with the Ga-Gd-oxide gate oxide layer serving as etch stop and not being adversely affected by contact with the HF etchant. Gd-Ge-oxide also exhibits a composition-dependent etch rate in HCl:H.sub.2 O.

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