Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state
Patent
1997-03-04
2000-04-25
Fahmy, Wael
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Using structure alterable to nonconductive state
438601, 438618, H01L 2182
Patent
active
060543396
ABSTRACT:
A shortened fuse link is disclosed. The fuse link comprises a first and second interconnect, with interconnects each being substantially longer than deep. The interconnects are disposed toward each other with a insulator region between them. A fusible conductor, spanning the insulator region, is attached at the top of the interconnects. The present device allows the length of the fusible conductor to be shortened, and results in a fuse link that can be consistently blown with a single laser pulse. Additionally, the fuse link can be used in a staggered layout. The staggered layout of parallel fuse links allows a high number of links in a relatively small area, with or without the use of tungsten barriers, and allows accessing all fuse links through a single fuse blow window.
REFERENCES:
patent: 4774561 (1988-09-01), Takagi
patent: 5618750 (1997-04-01), Fukura et al.
Stanley Wolf Ph.D. and Richard N. Tauber Ph.D. in Silicon Processing for the VLSI Era, vol. 1: Process Technology, Lattice Press, 1986.
Stanley Wolf Ph.D. in Silicon Processing for the VLSI Era, vol. 2: Process Integration, Lattice Press, 1990.
Minimum Groundrule, Electrically Blown Tungsten/Aluminum Fuse by Electromigration, IBM Technical Bulletin, vol. 31, No. 5, Oct. 1988.
Gilmour Richard A.
Uttecht Ronald R.
Walton Erick G.
Brewster William M.
Fahmy Wael
International Business Machines - Corporation
Walter Howard J.
LandOfFree
Fusible links formed on interconnects which are at least twice a does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fusible links formed on interconnects which are at least twice a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fusible links formed on interconnects which are at least twice a will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-992718