Fusible link in an integrated semiconductor circuit and process

Details Fusible link in an integrated semiconductor circuit and process Fusible link in an integrated semiconductor circuit and process

1997-01-08

2000-06-27

Niebling, John F.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438132, 438281, 438215, H01L 2144

Patent

active

060806494

ABSTRACT:
A fusible link in an integrated semiconductor circuit and a process for producing the fusible link contemplate the disposition of a fusible link, which is constructed with a cross-sectional constriction as a desired fusing point for its conductor track, in a void. A surface of the void and/or a bare conductor track can be covered with a protection layer, to prevent corrosion. The advantages of such a fusible link are a lower ignition energy and increased reliability. The fusible link may be used as a memory element of a PROM.

REFERENCES:
patent: 4045310 (1977-08-01), Jones et al.
patent: 4089734 (1978-05-01), Bierig
patent: 4198744 (1980-04-01), Nicolay
patent: 4209894 (1980-07-01), Keen
patent: 4536948 (1985-08-01), Te Velde et al.
patent: 4881114 (1989-11-01), Mohsen et al.
patent: 5903041 (1999-05-01), La Fleur et al.

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