Patent
1985-03-27
1985-09-24
James, Andrew J.
357 71, 357 59, 357 45, 357 2314, 357 236, H01L 21479, H01L 2354, H01L 2994, H01L 21326
Patent
active
045435944
ABSTRACT:
A capacitor-like MOS structure which provides a fusible link useful in a ROM, redundancy circuit, or the like is disclosed. An oxide layer insulates a polysilicon electrode from a doped substrate region. A potential is applied between the electrode and the doped region of sufficient magnitude to cause the oxide to rupture and to cause permanent filaments to be formed within the oxide. The filaments provide permanent conductive links between the polysilicon electrode and the doped substrate region.
REFERENCES:
patent: 3576549 (1971-04-01), Hess et al.
patent: 3634929 (1972-01-01), Yoshida et al.
patent: 3646305 (1972-02-01), Schimidtke et al.
patent: 3717852 (1973-02-01), Abbas et al.
patent: 3781977 (1974-01-01), Hulmes
patent: 3787822 (1974-01-01), Rioult
patent: 4072976 (1978-02-01), Harari
patent: 4322736 (1982-03-01), Sasaki et al.
patent: 4375086 (1983-02-01), Van Velthoven
Crook Dwight L.
Mohsen Amr M.
Clark Sheila V.
Intel Corporation
James Andrew J.
LandOfFree
Fusible link employing capacitor structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fusible link employing capacitor structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fusible link employing capacitor structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1616682