Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1985-12-05
1987-05-26
Makay, Albert J.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29574, 118664, 148 33, 148DIG7, 156DIG66, 427 8, B05D 100
Patent
active
046683305
ABSTRACT:
The invention described herein describes certain test wafers to be used in diagnosing heavy metal contamination in furnaces used in the manufacture of electronic devices and the method of referencing such wafers to a common wafer source for establishing an accurate baseline for a furnace to determine if it is functioning adequately or if an impurity or contaminant problem exists.
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patent: 4342616 (1982-08-01), Elliot et al.
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patent: 4440799 (1984-04-01), Faith, Jr.
patent: 4473795 (1984-09-01), Wood
patent: 4538105 (1985-08-01), Ausschnitt
Walter, "Alloying Ohmic Contacts Into GaAs Structures," IBM Technical Disclosure Bulletin, vol. 14, No. 6, 11-1971, p. 1940.
Calhoun, et al., "Product Simulators for Epitaxy Test Cycles," IBM Technical Disclosure Bulletin, vol. 12, No. 8, 01-1970, pp. 1214-1215.
Makay Albert J.
Monsanto Company
Passley Paul L.
Warner Steven E.
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